EMVCo bids to boost interoperability for contactless payments
EMVCo has published EMV® Level 1 Specifications for Payment Systems – EMV Contactless Interface Specification v3.0, according to finextra.com.
The enhanced specification, available on a royalty-free basis to all industry participants, addresses the interoperability needs between EMV acceptance devices and diverse EMV contactless payment form factors, including emerging technologies such as mobile handsets and wearables.
An objective of the enhanced specification is to increase alignment with ISO standards, in addition to industry bodies such as NFC Forum, to streamline the deployment and acceptance of contactless payment technologies across the world.
The supporting testing infrastructure has also been advanced with the introduction of new test equipment to better identify and reduce the risks of interoperability issues before EMV contactless products are deployed in the field.
Dariusz Mazurkiewicz – CEO at BLIK Polish Payment Standard
Banking 4.0 – „how was the experience for you”
„To be honest I think that Sinaia, your conference, is much better then Davos.”
Many more interesting quotes in the video below:
